Prof. Oren Regev
12/06/2025
אודיטוריום ע"ש דויד וואנג, בניין מידן, קומה 3
13:30
The aggressive miniaturization trends in the electronics industry present significant challenges in effective thermal management, as it can lead to increased operating temperatures and consequently performance degradation or failure. The efficiency of a heat spreading material is directly related to its thermal conductivity (TC). Conventional heat removal solutions (e.g., fans, fins, or metal heat sinks) may partially address the issue of heat accumulation, however, they are often characterized by substantial weight and size. Polymers are characterized by reduced density and ease of processing, however, they exhibit significantly lower TC. In my talk, a number of thermal management solutions will be presented and discussed. One such solution is conformal coating of printed circuit board (PCB) by polymer loaded with nanocarbon fillers that form an extensive thermally conductive network and yield an ultrahigh TC enhancement (×170) compared to the pristine polymer. Such coating could reduce the hotspot temperature of the PCB by 60°C.