Sputtering is a technique of thin film deposition. It consists of energetic ions accelerated towards a solid target. The collisions of the ions with the target result in breaking the chemical bonds between atoms on the solid target and ejecting the atoms out of the target. The ejected atoms coat the sample. The quality of the coating depends on the energy and flux of the ejected atoms, the temperature of the sample, and pressure in the chamber. This technique is utilized for depositing a large variety of coatings such as elemental metals, semiconductors and compound ceramics for numerous applications in microelectronics, optical, electro-optical, mechanical devices, etc.

For more information: Dr. Gary Frant +972-2-8294597